Tehnička dokumentacija
Tehnički podaci
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
10
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Current Rating
5.0A
Series Number
43045
Voltage Rating
250.0 V
Detalji o proizvodu
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
KM 37,94
KM 7,589 Each (In a Pack of 5) (bez PDV-a)
KM 44,39
KM 8,879 Each (In a Pack of 5) (s PDV-om)
Standard
5
KM 37,94
KM 7,589 Each (In a Pack of 5) (bez PDV-a)
KM 44,39
KM 8,879 Each (In a Pack of 5) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
Standard
5
Informacije o stanju skladišta trenutno nisu dostupne.
| količina | Jedinična cijena | Po pakovanje |
|---|---|---|
| 5 - 95 | KM 7,589 | KM 37,94 |
| 100 - 370 | KM 5,437 | KM 27,19 |
| 375 - 1495 | KM 5,398 | KM 26,99 |
| 1500 - 2995 | KM 4,655 | KM 23,27 |
| 3000+ | KM 4,635 | KM 23,18 |
Tehnička dokumentacija
Tehnički podaci
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
10
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Current Rating
5.0A
Series Number
43045
Voltage Rating
250.0 V
Detalji o proizvodu
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.


