Molex Micro-Fit 3.0 Series Right Angle Surface Mount PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

RS kataloški broj:: 447-6811robna marka: MolexProizvođački broj:: 43650-0212
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Tehnička dokumentacija

Tehnički podaci

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

2

Number Of Rows

1

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Surface Mount

Termination Method

Solder

Contact Plating

Tin

Contact Material

Brass

Series Number

43650

Current Rating

5.0A

Voltage Rating

250.0 V

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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KM 38,50

KM 7,70 Each (In a Pack of 5) (bez PDV-a)

KM 45,04

KM 9,009 Each (In a Pack of 5) (s PDV-om)

Molex Micro-Fit 3.0 Series Right Angle Surface Mount PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded
Odaberite vrstu pakovanja

KM 38,50

KM 7,70 Each (In a Pack of 5) (bez PDV-a)

KM 45,04

KM 9,009 Each (In a Pack of 5) (s PDV-om)

Molex Micro-Fit 3.0 Series Right Angle Surface Mount PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded
Informacije o stanju skladišta trenutno nisu dostupne.
Odaberite vrstu pakovanja

Kupujte na veliko

količinaJedinična cijenaPo pakovanje
5 - 95KM 7,70KM 38,50
100 - 370KM 6,424KM 32,12
375 - 1495KM 6,381KM 31,90
1500 - 2995KM 5,429KM 27,14
3000+KM 5,407KM 27,04

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više

Tehnička dokumentacija

Tehnički podaci

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

2

Number Of Rows

1

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Surface Mount

Termination Method

Solder

Contact Plating

Tin

Contact Material

Brass

Series Number

43650

Current Rating

5.0A

Voltage Rating

250.0 V

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više