Laird Technologies Self-Adhesive Thermal Interface Sheet, 5mm Thick, 1.2W/m·K, Ceramic Filled Silicone Rubber, 100 x

RS kataloški broj:: 446-572robna marka: Laird TechnologiesProizvođački broj:: U021041-19-U1
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Tehnička dokumentacija

Tehnički podaci

Dimensions

100 x 100mm

Thickness

5mm

Length

100mm

Width

100mm

Thermal Conductivity

1.2W/m·K

Material

Ceramic Filled Silicone Rubber

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+160°C

Hardness

Shore OO 27

Operating Temperature Range

-40 → +160 °C

Zemlja podrijetla

Czech Republic

Detalji o proizvodu

T-flex 300 & 3000

T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set, enabling the pad to be reused many times. Low thermal resistances can be achieved at low pressures.

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Cijena na upit

Laird Technologies Self-Adhesive Thermal Interface Sheet, 5mm Thick, 1.2W/m·K, Ceramic Filled Silicone Rubber, 100 x

Cijena na upit

Laird Technologies Self-Adhesive Thermal Interface Sheet, 5mm Thick, 1.2W/m·K, Ceramic Filled Silicone Rubber, 100 x

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Možda će vas zanimati

Tehnička dokumentacija

Tehnički podaci

Dimensions

100 x 100mm

Thickness

5mm

Length

100mm

Width

100mm

Thermal Conductivity

1.2W/m·K

Material

Ceramic Filled Silicone Rubber

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+160°C

Hardness

Shore OO 27

Operating Temperature Range

-40 → +160 °C

Zemlja podrijetla

Czech Republic

Detalji o proizvodu

T-flex 300 & 3000

T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set, enabling the pad to be reused many times. Low thermal resistances can be achieved at low pressures.

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