Tehnička dokumentacija
Tehnički podaci
Brand
Amphenol ICCNumber Of Contacts
15
Gender
Male
Body Orientation
Straight
Mounting Type
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
D-Sub Shell Size
E
Termination Method
Solder
Current Rating
2.5A
Housing Material
Steel
Voltage Rating
250.0 V
Length
30.81mm
Width
4.8mm
Depth
12.55mm
Dimensions
30.81 x 4.8 x 12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Minimum Operating Temperature
-55.0°C
Maximum Operating Temperature
+105°C
Zemlja podrijetla
China
Detalji o proizvodu
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
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Provjerite ponovno kasnije.
KM 3,55
Each (bez PDV-a)
KM 4,15
Each (s PDV-om)
1
KM 3,55
Each (bez PDV-a)
KM 4,15
Each (s PDV-om)
1
Kupujte na veliko
količina | Jedinična cijena |
---|---|
1 - 24 | KM 3,55 |
25 - 49 | KM 2,40 |
50 - 99 | KM 2,16 |
100 - 249 | KM 2,03 |
250+ | KM 1,90 |
Tehnička dokumentacija
Tehnički podaci
Brand
Amphenol ICCNumber Of Contacts
15
Gender
Male
Body Orientation
Straight
Mounting Type
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
D-Sub Shell Size
E
Termination Method
Solder
Current Rating
2.5A
Housing Material
Steel
Voltage Rating
250.0 V
Length
30.81mm
Width
4.8mm
Depth
12.55mm
Dimensions
30.81 x 4.8 x 12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Minimum Operating Temperature
-55.0°C
Maximum Operating Temperature
+105°C
Zemlja podrijetla
China
Detalji o proizvodu
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.