JST PA Series Straight Through Hole PCB Header, 9 Contact(s), 2.0mm Pitch, 1 Row(s), Shrouded
Tehnička dokumentacija
Tehnički podaci
Brand
JSTSeries
PA
Pitch
2.0mm
Number Of Contacts
9
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Plating
Tin
Contact Material
Copper Alloy
Current Rating
3.0A
Voltage Rating
250.0 V
Detalji o proizvodu
Top entry headers
2.0 mm JST PA Range
The PA interconnection system on a 2.0mm pitch provides a secure wire to board connection with additional locking device feature. The thumb depress mechanism prevents accidental disconnection during assembly or as a result of vibration. Suitable for a wide range of applications where a secure anti-vibration connection is required.
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PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
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- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
KM 78,23
KM 1,565 Each (Supplied in a Bag) (bez PDV-a)
KM 91,53
KM 1,831 Each (Supplied in a Bag) (s PDV-om)
Proizvodno pakovanje (kesa)
50
KM 78,23
KM 1,565 Each (Supplied in a Bag) (bez PDV-a)
KM 91,53
KM 1,831 Each (Supplied in a Bag) (s PDV-om)
Proizvodno pakovanje (kesa)
50
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Provjerite ponovno kasnije.
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Tehnička dokumentacija
Tehnički podaci
Brand
JSTSeries
PA
Pitch
2.0mm
Number Of Contacts
9
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Plating
Tin
Contact Material
Copper Alloy
Current Rating
3.0A
Voltage Rating
250.0 V
Detalji o proizvodu
Top entry headers
2.0 mm JST PA Range
The PA interconnection system on a 2.0mm pitch provides a secure wire to board connection with additional locking device feature. The thumb depress mechanism prevents accidental disconnection during assembly or as a result of vibration. Suitable for a wide range of applications where a secure anti-vibration connection is required.
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda