Tehnička dokumentacija
Tehnički podaci
Brand
MurataInductance
270 nH
Maximum dc Current
110mA
Package/Case
1005
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
4.94Ω
Series
LQG15HS
Maximum Self Resonant Frequency
400MHz
Minimum Quality Factor
8
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Detalji o proizvodu
Murata 0402 LQG15HS Series High Frequency Chip Inductors
LQGH15HS inductors from Murata are general use multilayer surface mount inductors. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.
Informacije o stanju skladišta trenutno nisu dostupne.
Provjerite ponovno kasnije.
KM 0,108
Each (Supplied on a Reel) (bez PDV-a)
KM 0,126
Each (Supplied on a Reel) (s PDV-om)
Proizvodno pakovanje (kolut)
100
KM 0,108
Each (Supplied on a Reel) (bez PDV-a)
KM 0,126
Each (Supplied on a Reel) (s PDV-om)
Proizvodno pakovanje (kolut)
100
Tehnička dokumentacija
Tehnički podaci
Brand
MurataInductance
270 nH
Maximum dc Current
110mA
Package/Case
1005
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
4.94Ω
Series
LQG15HS
Maximum Self Resonant Frequency
400MHz
Minimum Quality Factor
8
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Detalji o proizvodu
Murata 0402 LQG15HS Series High Frequency Chip Inductors
LQGH15HS inductors from Murata are general use multilayer surface mount inductors. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.