TE Connectivity FASTON .110 Uninsulated Female Spade Connector, Quick Disconnect Terminal, 2.79 x 0.51mm Tab Size,

RS kataloški broj:: 190-3112robna marka: TE ConnectivityProizvođački broj:: 160484-4IMPA: 0
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Tehnička dokumentacija

Tehnički podaci

Gender

Female

Insulation

Uninsulated

Termination Method

Crimp

Maximum Wire Size AWG

17AWG

Minimum Wire Size AWG

20AWG

Tab Size

2.79 x 0.51mm

Contact Material

Brass

Minimum Wire Size mm²

0.5mm²

Maximum Wire Size mm²

1mm²

Contact Plating

Tin

Overall Length

14mm

Material

Polyester

Brand

TE Connectivity

Series

FASTON .110

Detalji o proizvodu

Bernstein Wafer Tweezers (SA)

Precision wafer tweezers manufactured from high grade steel for the positioning of flat and fine components such as breakable wafer, PCB’s and LCD’s.

Informacije o stanju skladišta trenutno nisu dostupne.

Provjerite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

P.O.A.

TE Connectivity FASTON .110 Uninsulated Female Spade Connector, Quick Disconnect Terminal, 2.79 x 0.51mm Tab Size,

1

Dostupno u više komada 1
1P.O.A.
2P.O.A.
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4P.O.A.
5P.O.A.
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8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

P.O.A.

TE Connectivity FASTON .110 Uninsulated Female Spade Connector, Quick Disconnect Terminal, 2.79 x 0.51mm Tab Size,
Informacije o stanju skladišta trenutno nisu dostupne.

1

Dostupno u više komada 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

Tehnička dokumentacija

Tehnički podaci

Gender

Female

Insulation

Uninsulated

Termination Method

Crimp

Maximum Wire Size AWG

17AWG

Minimum Wire Size AWG

20AWG

Tab Size

2.79 x 0.51mm

Contact Material

Brass

Minimum Wire Size mm²

0.5mm²

Maximum Wire Size mm²

1mm²

Contact Plating

Tin

Overall Length

14mm

Material

Polyester

Brand

TE Connectivity

Series

FASTON .110

Detalji o proizvodu

Bernstein Wafer Tweezers (SA)

Precision wafer tweezers manufactured from high grade steel for the positioning of flat and fine components such as breakable wafer, PCB’s and LCD’s.