TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

RS kataloški broj:: 165-0967robna marka: TE ConnectivityProizvođački broj:: 5-5223955-2
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Tehnička dokumentacija

Tehnički podaci

Brand

TE Connectivity

Number Of Contacts

3

Type

Board to Board

Mounting Type

Through Hole

Body Orientation

Straight

Termination Method

Solder

Current Rating

1.15A

Voltage Rating

250 V

Series

Z-PACK HM

Contact Material

Copper

Zemlja podrijetla

China

Detalji o proizvodu

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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Informacije o stanju skladišta trenutno nisu dostupne.

Provjerite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

KM 724,14

KM 12,069 Each (In a Tube of 60) (bez PDV-a)

KM 847,24

KM 14,121 Each (In a Tube of 60) (s PDV-om)

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

60

Dostupno u više komada 60
60KM 724,14
120KM 1.448,28
180KM 2.172,42
240KM 2.896,56
300KM 3.620,69
360KM 4.344,83
420KM 5.068,97
480KM 5.793,11
540KM 6.517,25
600KM 7.241,39
660KM 7.965,53
720KM 8.689,67
780KM 9.413,81
840KM 10.137,94
900KM 10.862,08

KM 724,14

KM 12,069 Each (In a Tube of 60) (bez PDV-a)

KM 847,24

KM 14,121 Each (In a Tube of 60) (s PDV-om)

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination
Informacije o stanju skladišta trenutno nisu dostupne.

60

Dostupno u više komada 60
60KM 724,14
120KM 1.448,28
180KM 2.172,42
240KM 2.896,56
300KM 3.620,69
360KM 4.344,83
420KM 5.068,97
480KM 5.793,11
540KM 6.517,25
600KM 7.241,39
660KM 7.965,53
720KM 8.689,67
780KM 9.413,81
840KM 10.137,94
900KM 10.862,08

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više

Tehnička dokumentacija

Tehnički podaci

Brand

TE Connectivity

Number Of Contacts

3

Type

Board to Board

Mounting Type

Through Hole

Body Orientation

Straight

Termination Method

Solder

Current Rating

1.15A

Voltage Rating

250 V

Series

Z-PACK HM

Contact Material

Copper

Zemlja podrijetla

China

Detalji o proizvodu

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više