Tehnička dokumentacija
Tehnički podaci
Brand
WinbondMemory Size
256Mbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
16
Organisation
32M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
10.49mm
Height
2.34mm
Width
7.59mm
Dimensions
10.49 x 7.59 x 2.34mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns
Series
W25Q
Number of Words
32M
Minimum Operating Temperature
-40 °C
Informacije o stanju skladišta trenutno nisu dostupne.
Provjerite ponovno kasnije.
KM 10,814
Each (In a Tube of 44) (bez PDV-a)
KM 12,652
Each (In a Tube of 44) (s PDV-om)
44
KM 10,814
Each (In a Tube of 44) (bez PDV-a)
KM 12,652
Each (In a Tube of 44) (s PDV-om)
44
Tehnička dokumentacija
Tehnički podaci
Brand
WinbondMemory Size
256Mbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
16
Organisation
32M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
10.49mm
Height
2.34mm
Width
7.59mm
Dimensions
10.49 x 7.59 x 2.34mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns
Series
W25Q
Number of Words
32M
Minimum Operating Temperature
-40 °C