Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
TSSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Informacije o stanju skladišta trenutno nisu dostupne.
Provjerite ponovno kasnije.
KM 38,391
Each (In a Pack of 5) (bez PDV-a)
KM 44,918
Each (In a Pack of 5) (s PDV-om)
5
KM 38,391
Each (In a Pack of 5) (bez PDV-a)
KM 44,918
Each (In a Pack of 5) (s PDV-om)
5
Kupujte na veliko
količina | Jedinična cijena | Po pakovanje |
---|---|---|
5 - 120 | KM 38,391 | KM 191,96 |
125 - 370 | KM 35,147 | KM 175,74 |
375 - 995 | KM 32,444 | KM 162,22 |
1000 - 1995 | KM 29,74 | KM 148,70 |
2000+ | KM 28,658 | KM 143,29 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
TSSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.