331011452048, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.6mm x 2mm x 4.8mm

Name: 331011452048, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.6mm x 2mm x 4.8mm
Brand: Wurth Elektronik
SKU: 7734236
Availability: LimitedAvailability

RS kataloški broj:: 773-4236brend: Wurth ElektronikProizvođački broj:: 331011452048

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Tehnička dokumentacija

Tehnički podaci

Brand

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

4.8mm

Length

4.6mm

Width_SC_PC

2mm

Detalji o proizvodu

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Informacije o stanju skladišta trenutno nisu dostupne.

Proverite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

RSD 1.176

RSD 235,143 komad (u vrečici od 5) (bez PDV-a)

RSD 1.411

RSD 282,172 komad (u vrečici od 5) (s PDV-om)

331011452048, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.6mm x 2mm x 4.8mm

RSD 1.176

RSD 235,143 komad (u vrečici od 5) (bez PDV-a)

RSD 1.411

RSD 282,172 komad (u vrečici od 5) (s PDV-om)

331011452048, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.6mm x 2mm x 4.8mm

Informacije o stanju skladišta trenutno nisu dostupne.

Kupujte na veliko

količina	Jedinična cena	Po kesa
5 - 20	RSD 235,143	RSD 1.176
25 - 45	RSD 227,305	RSD 1.137
50 - 95	RSD 216,854	RSD 1.084
100 - 245	RSD 215,548	RSD 1.078
250+	RSD 201,178	RSD 1.006

Tehnička dokumentacija

Tehnički podaci

Brand

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

4.8mm

Length

4.6mm

Width_SC_PC

2mm

Detalji o proizvodu

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.