Nova, Through Hole Ceramic Capacitor Kit 600 pieces

RS kataloški broj:: 112-6771robna marka: NovaProizvođački broj:: CCC-31
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Tehnička dokumentacija

Tehnički podaci

Dielectric Material

Ceramic

Kit Includes

Ceramic

Maximum Voltage

100V dc

Voltage Range

100V dc

Series Number

2178711-4

Number of Pieces

600

Mounting Type

Through Hole

Brand

Nova

Zemlja podrijetla

Netherlands

Detalji o proizvodu

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Informacije o stanju skladišta trenutno nisu dostupne.

Provjerite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

KM 465,02

Each (bez PDV-a)

KM 544,07

Each (s PDV-om)

Nova, Through Hole Ceramic Capacitor Kit 600 pieces

1

Dostupno u više komada 1
1KM 465,02
2KM 930,05
3KM 1.395,07
4KM 1.860,09
5KM 2.195,34
6KM 2.634,41
7KM 3.073,48
8KM 3.512,55
9KM 3.951,62
10KM 4.282,54
11KM 4.710,80
12KM 5.139,05
13KM 5.567,30
14KM 5.995,56
15KM 6.423,81

KM 465,02

Each (bez PDV-a)

KM 544,07

Each (s PDV-om)

Nova, Through Hole Ceramic Capacitor Kit 600 pieces
Informacije o stanju skladišta trenutno nisu dostupne.

1

Dostupno u više komada 1
1KM 465,02
2KM 930,05
3KM 1.395,07
4KM 1.860,09
5KM 2.195,34
6KM 2.634,41
7KM 3.073,48
8KM 3.512,55
9KM 3.951,62
10KM 4.282,54
11KM 4.710,80
12KM 5.139,05
13KM 5.567,30
14KM 5.995,56
15KM 6.423,81

Kupujte na veliko

količinaJedinična cijena
1 - 4KM 465,02
5 - 9KM 439,07
10+KM 428,25

Tehnička dokumentacija

Tehnički podaci

Dielectric Material

Ceramic

Kit Includes

Ceramic

Maximum Voltage

100V dc

Voltage Range

100V dc

Series Number

2178711-4

Number of Pieces

600

Mounting Type

Through Hole

Brand

Nova

Zemlja podrijetla

Netherlands

Detalji o proizvodu

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.