Tehnička dokumentacija
Tehnički podaci
Proizvođač
KYOCERA AVXCapacitance
0.2pF
Tolerance
±0.1pF
Voltage
250V dc
Mounting Type
Surface Mount
Temperature Coefficient
0±30ppm/°C
Dielectric
Polymer
Package/Case
0603 (1608M)
Dimensions
1.6 x 0.838 x 0.635mm
Operating Temperature Range
-55 → +125 °C
Depth
0.84mm
Height
0.64mm
Length
1.6mm
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Detalji o proizvodu
AVX Multilayer Organic Capacitors, ML Series
Based on its patented multilayer low loss organic (MLO™) technology. These new capacitors represent a paradigm shift from traditional ceramic and thin film passive SMD components. Multilayer Organic Capacitors are polymer based capacitors that use high conductivity copper interconnects in a multilayer fashion.
Multilayer Organic Film Capacitors
Informacije o stanju skladišta trenutno nisu dostupne.
Provjerite ponovno kasnije.
€ 0,52
komadno (u pakiranju od 10) (bez PDV-a)
€ 0,65
komadno (u pakiranju od 10) (s PDV-om)
Standard
10
€ 0,52
komadno (u pakiranju od 10) (bez PDV-a)
€ 0,65
komadno (u pakiranju od 10) (s PDV-om)
Standard
10
Kupujte na veliko
količina | jedinična cijena | Po pakiranje |
---|---|---|
10 - 90 | € 0,52 | € 5,20 |
100 - 240 | € 0,35 | € 3,50 |
250 - 490 | € 0,33 | € 3,30 |
500 - 990 | € 0,32 | € 3,20 |
1000+ | € 0,31 | € 3,10 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
KYOCERA AVXCapacitance
0.2pF
Tolerance
±0.1pF
Voltage
250V dc
Mounting Type
Surface Mount
Temperature Coefficient
0±30ppm/°C
Dielectric
Polymer
Package/Case
0603 (1608M)
Dimensions
1.6 x 0.838 x 0.635mm
Operating Temperature Range
-55 → +125 °C
Depth
0.84mm
Height
0.64mm
Length
1.6mm
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Detalji o proizvodu
AVX Multilayer Organic Capacitors, ML Series
Based on its patented multilayer low loss organic (MLO™) technology. These new capacitors represent a paradigm shift from traditional ceramic and thin film passive SMD components. Multilayer Organic Capacitors are polymer based capacitors that use high conductivity copper interconnects in a multilayer fashion.