Tehnička dokumentacija
Tehnički podaci
Proizvođač
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43650
Current Rating
5.0A
Voltage Rating
250.0 V
Zemlja podrijetla
Mexico
Detalji o proizvodu
Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Informacije o stanju skladišta trenutno nisu dostupne.
Provjerite ponovno kasnije.
€ 1,73
komadno (u pakiranju od 5) (bez PDV-a)
€ 2,162
komadno (u pakiranju od 5) (s PDV-om)
Standard
5
€ 1,73
komadno (u pakiranju od 5) (bez PDV-a)
€ 2,162
komadno (u pakiranju od 5) (s PDV-om)
Standard
5
Tehnička dokumentacija
Tehnički podaci
Proizvođač
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43650
Current Rating
5.0A
Voltage Rating
250.0 V
Zemlja podrijetla
Mexico
Detalji o proizvodu
Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.