Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinbondMemory Size
2Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
256M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Number of Words
256M
Minimum Operating Temperature
-40 °C
Informacije o stanju skladišta trenutno nisu dostupne.
Provjerite ponovno kasnije.
P.O.A.
480
P.O.A.
480
Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinbondMemory Size
2Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
256M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Number of Words
256M
Minimum Operating Temperature
-40 °C