Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.5 mm, 2.54 mm
End 1
8 Pin Female SOP
End 2
8 Pin Male DIP
End 1 Number of Contacts
8
End 2 Number of Contacts
8
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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Provjerite ponovno kasnije.
€ 57,55
€ 11,51 komadno (u pakiranju od 5) (bez PDV-a)
€ 71,94
€ 14,388 komadno (u pakiranju od 5) (s PDV-om)
5
€ 57,55
€ 11,51 komadno (u pakiranju od 5) (bez PDV-a)
€ 71,94
€ 14,388 komadno (u pakiranju od 5) (s PDV-om)
5
Kupujte na veliko
količina | jedinična cijena | Po pakiranje |
---|---|---|
5 - 120 | € 11,51 | € 57,55 |
125 - 370 | € 10,50 | € 52,50 |
375 - 995 | € 9,71 | € 48,55 |
1000 - 1995 | € 8,86 | € 44,30 |
2000+ | € 8,55 | € 42,75 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.5 mm, 2.54 mm
End 1
8 Pin Female SOP
End 2
8 Pin Male DIP
End 1 Number of Contacts
8
End 2 Number of Contacts
8
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.