Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
KM 143,26
KM 28,652 Each (In a Pack of 5) (bez PDV-a)
KM 167,61
KM 33,523 Each (In a Pack of 5) (s PDV-om)
5
KM 143,26
KM 28,652 Each (In a Pack of 5) (bez PDV-a)
KM 167,61
KM 33,523 Each (In a Pack of 5) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
5
Informacije o stanju skladišta trenutno nisu dostupne.
količina | Jedinična cijena | Po pakovanje |
---|---|---|
5 - 120 | KM 28,652 | KM 143,26 |
125 - 370 | KM 26,149 | KM 130,75 |
375 - 995 | KM 24,232 | KM 121,16 |
1000 - 1995 | KM 22,061 | KM 110,31 |
2000+ | KM 21,279 | KM 106,40 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.