Tehnička dokumentacija
Tehnički podaci
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
4
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Current Rating
5.0A
Series Number
43045
Voltage Rating
250.0 V
Detalji o proizvodu
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
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Provjerite ponovno kasnije.
€ 4,13
Each (In a Pack of 5) (bez PDV-a)
€ 4,832
Each (In a Pack of 5) (s PDV-om)
Standard
5
€ 4,13
Each (In a Pack of 5) (bez PDV-a)
€ 4,832
Each (In a Pack of 5) (s PDV-om)
Standard
5
Kupujte na veliko
količina | Jedinična cijena | Po pakovanje |
---|---|---|
5 - 95 | € 4,13 | € 20,65 |
100+ | € 3,34 | € 16,70 |
Tehnička dokumentacija
Tehnički podaci
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
4
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Current Rating
5.0A
Series Number
43045
Voltage Rating
250.0 V
Detalji o proizvodu
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.