Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm

RS kataloški broj:: 362-9676robna marka: BergquistProizvođački broj:: HF625-0.005-AC-104IMPA: 0
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Tehnička dokumentacija

Tehnički podaci

Thermal Conductivity

0.5W/m·K

Material

Hi-Flow 625

Self-Adhesive

Yes

Material Trade Name

Hi-Flow 625

Minimum Operating Temperature

-30°C

Maximum Operating Temperature

+150°C

Thickness

0.127mm

Operating Temperature Range

-30 → +150 °C

Width

19mm

Length

25mm

Dimensions

25 x 19mm

Zemlja podrijetla

United States

Detalji o proizvodu

IDC Cabling Gun

2.54mm Kontek Comatel HE14 IEC 603-8 Range

Tin plated board to board/board to wire interconnection system

Informacije o stanju skladišta trenutno nisu dostupne.

Provjerite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

€ 2,25

Each (In a Pack of 50) (bez PDV-a)

€ 2,632

Each (In a Pack of 50) (s PDV-om)

Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm

€ 2,25

Each (In a Pack of 50) (bez PDV-a)

€ 2,632

Each (In a Pack of 50) (s PDV-om)

Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm
Informacije o stanju skladišta trenutno nisu dostupne.

Kupujte na veliko

količinaJedinična cijenaPo pakovanje
50 - 450€ 2,25€ 112,50
500 - 2450€ 2,05€ 102,50
2500+€ 1,92€ 96,00

Tehnička dokumentacija

Tehnički podaci

Thermal Conductivity

0.5W/m·K

Material

Hi-Flow 625

Self-Adhesive

Yes

Material Trade Name

Hi-Flow 625

Minimum Operating Temperature

-30°C

Maximum Operating Temperature

+150°C

Thickness

0.127mm

Operating Temperature Range

-30 → +150 °C

Width

19mm

Length

25mm

Dimensions

25 x 19mm

Zemlja podrijetla

United States

Detalji o proizvodu

IDC Cabling Gun

2.54mm Kontek Comatel HE14 IEC 603-8 Range

Tin plated board to board/board to wire interconnection system