Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
6 Pin Female SOP
End 2
6 Pin Male DIP
End 1 Number of Contacts
6
End 2 Number of Contacts
6
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
RSD 842,595
komadno (u pakovanju od 5) (bez PDV-a)
RSD 1.011,114
komadno (u pakovanju od 5) (s PDV-om)
5
RSD 842,595
komadno (u pakovanju od 5) (bez PDV-a)
RSD 1.011,114
komadno (u pakovanju od 5) (s PDV-om)
5
Kupujte na veliko
količina | Jedinična cena | Po pakovanje |
---|---|---|
5 - 120 | RSD 842,595 | RSD 4.213 |
125 - 370 | RSD 764,214 | RSD 3.821 |
375 - 995 | RSD 711,96 | RSD 3.560 |
1000 - 1995 | RSD 646,643 | RSD 3.233 |
2000+ | RSD 627,048 | RSD 3.135 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
6 Pin Female SOP
End 2
6 Pin Male DIP
End 1 Number of Contacts
6
End 2 Number of Contacts
6
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.