Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.63 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 123,30
€ 24,66 Each (In a Pack of 5) (bez PDV-a)
€ 144,26
€ 28,852 Each (In a Pack of 5) (s PDV-om)
5
€ 123,30
€ 24,66 Each (In a Pack of 5) (bez PDV-a)
€ 144,26
€ 28,852 Each (In a Pack of 5) (s PDV-om)
5
Informacije o stanju skladišta trenutno nisu dostupne.
Provjerite ponovno kasnije.
količina | Jedinična cijena | Po pakovanje |
---|---|---|
5 - 120 | € 24,66 | € 123,30 |
125 - 370 | € 22,51 | € 112,55 |
375 - 995 | € 20,85 | € 104,25 |
1000 - 1995 | € 18,98 | € 94,90 |
2000+ | € 18,31 | € 91,55 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.63 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.