Tehnička dokumentacija
Tehnički podaci
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55935
Current Rating
3.0A
Voltage Rating
250.0 V
Zemlja podrijetla
Japan
Detalji o proizvodu
Single Row Right Angle Header with Boss
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
RSD 875
RSD 87,525 komadno (u pakovanju od 10) (bez PDV-a)
RSD 1.050
RSD 105,03 komadno (u pakovanju od 10) (s PDV-om)
Standard
10
RSD 875
RSD 87,525 komadno (u pakovanju od 10) (bez PDV-a)
RSD 1.050
RSD 105,03 komadno (u pakovanju od 10) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
Standard
10
Informacije o stanju skladišta trenutno nisu dostupne.
količina | Jedinična cena | Po pakovanje |
---|---|---|
10 - 190 | RSD 87,525 | RSD 875 |
200 - 740 | RSD 69,236 | RSD 692 |
750 - 2990 | RSD 67,93 | RSD 679 |
3000+ | RSD 64,011 | RSD 640 |
Tehnička dokumentacija
Tehnički podaci
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55935
Current Rating
3.0A
Voltage Rating
250.0 V
Zemlja podrijetla
Japan
Detalji o proizvodu
Single Row Right Angle Header with Boss
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.