Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass

RS kataloški broj:: 169-2420robna marka: BergquistProizvođački broj:: SP2000-0.015-00-21
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Tehnička dokumentacija

Tehnički podaci

Brand

Bergquist

Thickness

0.015in

Diameter

20.32mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad 2000

Operating Temperature Range

-60 → +200 °C

Zemlja podrijetla

United States

Detalji o proizvodu

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.

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P.O.A.

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass

10

Dostupno u više komada 10
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

P.O.A.

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass
Informacije o stanju skladišta trenutno nisu dostupne.

10

Dostupno u više komada 10
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

Tehnička dokumentacija

Tehnički podaci

Brand

Bergquist

Thickness

0.015in

Diameter

20.32mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad 2000

Operating Temperature Range

-60 → +200 °C

Zemlja podrijetla

United States

Detalji o proizvodu

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.