Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

RS kataloški broj:: 752-4897robna marka: BergquistProizvođački broj:: HF650P-0.001-01-00-43
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Tehnička dokumentacija

Tehnički podaci

Proizvođač

Bergquist

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

PRICED TO CLEAR

Yes

Zemlja podrijetla

United States

Detalji o proizvodu

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

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P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Informacije o stanju skladišta trenutno nisu dostupne.

Tehnička dokumentacija

Tehnički podaci

Proizvođač

Bergquist

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

PRICED TO CLEAR

Yes

Zemlja podrijetla

United States

Detalji o proizvodu

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.