Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Tehnička dokumentacija
Tehnički podaci
Proizvođač
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Zemlja podrijetla
United States
Detalji o proizvodu
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
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Provjerite ponovno kasnije.
€ 1,62
komadno (u vrećici od 50) (bez PDV-a)
€ 2,025
komadno (u vrećici od 50) (s PDV-om)
50
€ 1,62
komadno (u vrećici od 50) (bez PDV-a)
€ 2,025
komadno (u vrećici od 50) (s PDV-om)
50
Tehnička dokumentacija
Tehnički podaci
Proizvođač
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Zemlja podrijetla
United States
Detalji o proizvodu
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.