Tehnička dokumentacija
Tehnički podaci
Proizvođač
BergquistDimensions
11 x 12in
Thickness
0.001in
Length
11in
Width
12in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Zemlja podrijetla
United States
Detalji o proizvodu
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
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Provjerite ponovno kasnije.
€ 175,00
komadno (bez PDV-a)
€ 218,75
komadno (s PDV-om)
1
€ 175,00
komadno (bez PDV-a)
€ 218,75
komadno (s PDV-om)
1
Kupujte na veliko
količina | jedinična cijena |
---|---|
1 - 9 | € 175,00 |
10+ | € 164,00 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
BergquistDimensions
11 x 12in
Thickness
0.001in
Length
11in
Width
12in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Zemlja podrijetla
United States
Detalji o proizvodu
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.