Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 41.91 x 28.96mm
Tehnička dokumentacija
Tehnički podaci
Proizvođač
BergquistDimensions
41.91 x 28.96mm
Thickness
0.015in
Length
41.91mm
Width
28.96mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Zemlja podrijetla
United States
Detalji o proizvodu
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
€ 90,70
€ 9,07 komadno (u pakiranju od 10) (bez PDV-a)
€ 113,38
€ 11,338 komadno (u pakiranju od 10) (s PDV-om)
10
€ 90,70
€ 9,07 komadno (u pakiranju od 10) (bez PDV-a)
€ 113,38
€ 11,338 komadno (u pakiranju od 10) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
10
Informacije o stanju skladišta trenutno nisu dostupne.
| količina | jedinična cijena | Po pakiranje |
|---|---|---|
| 10 - 40 | € 9,07 | € 90,70 |
| 50 - 240 | € 8,77 | € 87,70 |
| 250+ | € 8,74 | € 87,40 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
BergquistDimensions
41.91 x 28.96mm
Thickness
0.015in
Length
41.91mm
Width
28.96mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Zemlja podrijetla
United States
Detalji o proizvodu
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.