Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 25.4 x 19.05mm
Tehnička dokumentacija
Tehnički podaci
Proizvođač
BergquistDimensions
25.4 x 19.05mm
Thickness
0.015in
Length
25.4mm
Width
19.05mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Zemlja podrijetla
United States
Detalji o proizvodu
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
€ 30,50
€ 3,05 komadno (u pakiranju od 10) (bez PDV-a)
€ 38,12
€ 3,812 komadno (u pakiranju od 10) (s PDV-om)
10
€ 30,50
€ 3,05 komadno (u pakiranju od 10) (bez PDV-a)
€ 38,12
€ 3,812 komadno (u pakiranju od 10) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
10
Informacije o stanju skladišta trenutno nisu dostupne.
| količina | jedinična cijena | Po pakiranje |
|---|---|---|
| 10 - 40 | € 3,05 | € 30,50 |
| 50 - 190 | € 2,78 | € 27,80 |
| 200+ | € 2,75 | € 27,50 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
BergquistDimensions
25.4 x 19.05mm
Thickness
0.015in
Length
25.4mm
Width
19.05mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Zemlja podrijetla
United States
Detalji o proizvodu
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.