HARWIN 7.25 mm Grounding Contact
Tehnička dokumentacija
Tehnički podaci
Proizvođač
HARWINProduct Type
Grounding Contact
Material
Beryllium Copper Alloy
Fixing Method
Surface Mount
Contact Resistance
20mΩ
Current
7A
Contact Plating
Tin over Nickel
Height
7.25mm
Width
5.7 mm
Length
9.59mm
Standards/Approvals
EIA 481
Zemlja podrijetla
Taiwan, Province Of China
Detalji o proizvodu
Harwin EZ Boardware SMT RFI/Grounding Spring Contacts
EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.
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PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Informacije o stanju skladišta trenutno nisu dostupne.
€ 129,50
€ 0,37 Each (On a Reel of 350) (bez PDV-a)
€ 161,88
€ 0,462 Each (On a Reel of 350) (s PDV-om)
350
€ 129,50
€ 0,37 Each (On a Reel of 350) (bez PDV-a)
€ 161,88
€ 0,462 Each (On a Reel of 350) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
350
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Tehnička dokumentacija
Tehnički podaci
Proizvođač
HARWINProduct Type
Grounding Contact
Material
Beryllium Copper Alloy
Fixing Method
Surface Mount
Contact Resistance
20mΩ
Current
7A
Contact Plating
Tin over Nickel
Height
7.25mm
Width
5.7 mm
Length
9.59mm
Standards/Approvals
EIA 481
Zemlja podrijetla
Taiwan, Province Of China
Detalji o proizvodu
Harwin EZ Boardware SMT RFI/Grounding Spring Contacts
EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda