Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row(s), Shrouded

RS kataloški broj:: 670-0333Probna marka: MolexProizvođački broj:: 43045-0413
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Tehnička dokumentacija

Tehnički podaci

Proizvođač

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

8.5A

Number of Contacts

4

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Gold

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

125°C

Mating Pin Length

3mm

Standards/Approvals

No

Voltage

600 V

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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PRIDRUŽITE SE BESPLATNO

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Informacije o stanju skladišta trenutno nisu dostupne.

€ 140,00

€ 1,40 Each (Supplied in a Bag) (bez PDV-a)

€ 175,00

€ 1,75 Each (Supplied in a Bag) (s PDV-om)

Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row(s), Shrouded
Odaberite vrstu pakiranja

€ 140,00

€ 1,40 Each (Supplied in a Bag) (bez PDV-a)

€ 175,00

€ 1,75 Each (Supplied in a Bag) (s PDV-om)

Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row(s), Shrouded

Informacije o stanju skladišta trenutno nisu dostupne.

Odaberite vrstu pakiranja

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više

Tehnička dokumentacija

Tehnički podaci

Proizvođač

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

8.5A

Number of Contacts

4

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Gold

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

125°C

Mating Pin Length

3mm

Standards/Approvals

No

Voltage

600 V

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više