Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 8 Contact(s), 3 mm Pitch, 2 Row(s), Shrouded

Tehnička dokumentacija
Tehnički podaci
Proizvođač
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
8
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Maximum Operating Temperature
105°C
Contact Gender
Male
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-40-670
Detalji o proizvodu
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
Molex Micro-Fit 3.0 Series
Informacije o stanju skladišta trenutno nisu dostupne.
€ 16,25
€ 3,25 komadno (u pakiranju od 5) (bez PDV-a)
€ 20,31
€ 4,062 komadno (u pakiranju od 5) (s PDV-om)
Standard
5
€ 16,25
€ 3,25 komadno (u pakiranju od 5) (bez PDV-a)
€ 20,31
€ 4,062 komadno (u pakiranju od 5) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
Standard
5
| količina | jedinična cijena | Po pakiranje |
|---|---|---|
| 5 - 45 | € 3,25 | € 16,25 |
| 50 - 95 | € 2,57 | € 12,85 |
| 100 - 245 | € 2,42 | € 12,10 |
| 250 - 495 | € 2,41 | € 12,05 |
| 500+ | € 2,40 | € 12,00 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
8
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Maximum Operating Temperature
105°C
Contact Gender
Male
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-40-670
Detalji o proizvodu
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

