Molex Micro-Fit 3.0 Series Straight Through Hole PCB Socket, 6-Contact, 1 Row, 3 mm Pitch Solder

RS kataloški broj:: 670-4799robna marka: MolexProizvođački broj:: 43650-0629Distrelec broj artikla: 304-62-233
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Prikaži sve u PCB Sockets

Tehnička dokumentacija

Tehnički podaci

Proizvođač

Molex

Number of Contacts

6

Product Type

PCB Socket

Number of Rows

1

Sub Type

Wire-to-Board

Pitch

3mm

Current

12A

Termination Type

Solder

Housing Material

Thermoplastic

Mount Type

Through Hole

Orientation

Straight

Connector System

Power, Wire-to-Board

Voltage

250 V

Series

Micro-Fit 3.0

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

125°C

Contact Material

Brass

Contact Plating

Brass

Standards/Approvals

No

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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Prikaži sve u PCB Sockets

Informacije o stanju skladišta trenutno nisu dostupne.

€ 8,75

€ 1,75 komadno (u pakiranju od 5) (bez PDV-a)

€ 10,94

€ 2,188 komadno (u pakiranju od 5) (s PDV-om)

Molex Micro-Fit 3.0 Series Straight Through Hole PCB Socket, 6-Contact, 1 Row, 3 mm Pitch Solder

€ 8,75

€ 1,75 komadno (u pakiranju od 5) (bez PDV-a)

€ 10,94

€ 2,188 komadno (u pakiranju od 5) (s PDV-om)

Molex Micro-Fit 3.0 Series Straight Through Hole PCB Socket, 6-Contact, 1 Row, 3 mm Pitch Solder

Informacije o stanju skladišta trenutno nisu dostupne.

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više

Tehnička dokumentacija

Tehnički podaci

Proizvođač

Molex

Number of Contacts

6

Product Type

PCB Socket

Number of Rows

1

Sub Type

Wire-to-Board

Pitch

3mm

Current

12A

Termination Type

Solder

Housing Material

Thermoplastic

Mount Type

Through Hole

Orientation

Straight

Connector System

Power, Wire-to-Board

Voltage

250 V

Series

Micro-Fit 3.0

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

125°C

Contact Material

Brass

Contact Plating

Brass

Standards/Approvals

No

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više