Tehnička dokumentacija
Tehnički podaci
Proizvođač
STMicroelectronicsTransistor Type
NPN
Maximum DC Collector Current
500 mA
Maximum Collector Emitter Voltage
300 V
Package Type
SOT-32
Mounting Type
Through Hole
Maximum Power Dissipation
2.8 W
Minimum DC Current Gain
30
Transistor Configuration
Single
Maximum Collector Base Voltage
300 V
Maximum Emitter Base Voltage
3 V
Pin Count
3
Number of Elements per Chip
1
Maximum Operating Temperature
+150 °C
Dimensions
10.8 x 7.8 x 2.7mm
Zemlja podrijetla
Malaysia
Detalji o proizvodu
High Voltage Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.
Informacije o stanju skladišta trenutno nisu dostupne.
€ 30,00
€ 0,60 komadno (u cijevi od 50) (bez PDV-a)
€ 37,50
€ 0,75 komadno (u cijevi od 50) (s PDV-om)
50
€ 30,00
€ 0,60 komadno (u cijevi od 50) (bez PDV-a)
€ 37,50
€ 0,75 komadno (u cijevi od 50) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
50
| količina | jedinična cijena | Po cijev |
|---|---|---|
| 50 - 50 | € 0,60 | € 30,00 |
| 100 - 450 | € 0,43 | € 21,50 |
| 500 - 950 | € 0,39 | € 19,50 |
| 1000+ | € 0,34 | € 17,00 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
STMicroelectronicsTransistor Type
NPN
Maximum DC Collector Current
500 mA
Maximum Collector Emitter Voltage
300 V
Package Type
SOT-32
Mounting Type
Through Hole
Maximum Power Dissipation
2.8 W
Minimum DC Current Gain
30
Transistor Configuration
Single
Maximum Collector Base Voltage
300 V
Maximum Emitter Base Voltage
3 V
Pin Count
3
Number of Elements per Chip
1
Maximum Operating Temperature
+150 °C
Dimensions
10.8 x 7.8 x 2.7mm
Zemlja podrijetla
Malaysia
Detalji o proizvodu
High Voltage Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.


