Tehnička dokumentacija
Tehnički podaci
Brand
Syfer TechnologyCapacitance
33nF
Product Type
Multilayer Ceramic Capacitor
Mount Type
Surface Mount
Dielectric
X7R
Tolerance
±10 %
Minimum Operating Temperature
-55°C
Termination Type
Surface Mount
Series
Flexicap
Length
2mm
Height
1.3mm
Maximum Operating Temperature
125°C
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
Syfer Flexicap 0805
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
Informacije o stanju skladišta trenutno nisu dostupne.
Cijena na upit
Each (On a Reel of 3000) (bez PDV-a)
3000
Cijena na upit
Each (On a Reel of 3000) (bez PDV-a)
Informacije o stanju skladišta trenutno nisu dostupne.
3000
Tehnička dokumentacija
Tehnički podaci
Brand
Syfer TechnologyCapacitance
33nF
Product Type
Multilayer Ceramic Capacitor
Mount Type
Surface Mount
Dielectric
X7R
Tolerance
±10 %
Minimum Operating Temperature
-55°C
Termination Type
Surface Mount
Series
Flexicap
Length
2mm
Height
1.3mm
Maximum Operating Temperature
125°C
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
Syfer Flexicap 0805
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
