TE Connectivity Vibration Sensor, 0°C → +70°C
Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityLength
41mm
Width
16mm
Depth
0.04mm
Minimum Operating Temperature
0°C
Maximum Operating Temperature
+70°C
Dimensions
41 (mm) x 16 (mm) x 40 (μm)
Detalji o proizvodu
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.
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€ 22,00
komadno (bez PDV-a)
€ 27,50
komadno (s PDV-om)
1
€ 22,00
komadno (bez PDV-a)
€ 27,50
komadno (s PDV-om)
1
Kupujte na veliko
| količina | jedinična cijena |
|---|---|
| 1 - 9 | € 22,00 |
| 10 - 24 | € 15,75 |
| 25 - 49 | € 15,25 |
| 50 - 99 | € 14,50 |
| 100+ | € 14,25 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityLength
41mm
Width
16mm
Depth
0.04mm
Minimum Operating Temperature
0°C
Maximum Operating Temperature
+70°C
Dimensions
41 (mm) x 16 (mm) x 40 (μm)
Detalji o proizvodu
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.