TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

RS kataloški broj:: 718-1544robna marka: TE ConnectivityProizvođački broj:: 120954-1
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Prikaži sve u Backplane Connectors

Tehnička dokumentacija

Tehnički podaci

Proizvođač

TE Connectivity

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Contact Plating

Gold

Current Rating

16A

Termination Method

Press Fit

Series

Z-PACK

Zemlja podrijetla

United States

Detalji o proizvodu

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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€ 12,82

€ 12,82 komadno (bez PDV-a)

€ 16,02

€ 16,02 komadno (s PDV-om)

TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way
Odaberite vrstu pakiranja

€ 12,82

€ 12,82 komadno (bez PDV-a)

€ 16,02

€ 16,02 komadno (s PDV-om)

TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

Informacije o stanju skladišta trenutno nisu dostupne.

Odaberite vrstu pakiranja

Informacije o stanju skladišta trenutno nisu dostupne.

količinajedinična cijena
1 - 19€ 12,82
20 - 74€ 12,36
75+€ 12,23

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više

Tehnička dokumentacija

Tehnički podaci

Proizvođač

TE Connectivity

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Contact Plating

Gold

Current Rating

16A

Termination Method

Press Fit

Series

Z-PACK

Zemlja podrijetla

United States

Detalji o proizvodu

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više