Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Contact Plating
Gold
Current Rating
16A
Termination Method
Press Fit
Series
Z-PACK
Zemlja podrijetla
United States
Detalji o proizvodu
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
€ 18,40
€ 18,40 komadno (bez PDV-a)
€ 23,00
€ 23,00 komadno (s PDV-om)
Standard
1
€ 18,40
€ 18,40 komadno (bez PDV-a)
€ 23,00
€ 23,00 komadno (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
Standard
1
Informacije o stanju skladišta trenutno nisu dostupne.
Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Contact Plating
Gold
Current Rating
16A
Termination Method
Press Fit
Series
Z-PACK
Zemlja podrijetla
United States
Detalji o proizvodu
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


