Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityGender
Female
Product Type
Crimp Terminal
For Use With
AMPMODU MOD IV Connector Housing
Current
3A
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.2mm²
Minimum Wire Size AWG
24AWG
Contact Plating
Gold
Maximum Wire Size mm²
0.6mm²
Maximum Wire Size AWG
20AWG
Contact Material
Phosphor Bronze
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Termination Type
Crimp
Maximum Operating Temperature
105°C
Length
18.03mm
Standards/Approvals
No
Detalji o proizvodu
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
Informacije o stanju skladišta trenutno nisu dostupne.
€ 10.150,00
€ 0,58 Each (On a Reel of 17500) (bez PDV-a)
€ 12.687,50
€ 0,725 Each (On a Reel of 17500) (s PDV-om)
17500
€ 10.150,00
€ 0,58 Each (On a Reel of 17500) (bez PDV-a)
€ 12.687,50
€ 0,725 Each (On a Reel of 17500) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
17500
Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityGender
Female
Product Type
Crimp Terminal
For Use With
AMPMODU MOD IV Connector Housing
Current
3A
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.2mm²
Minimum Wire Size AWG
24AWG
Contact Plating
Gold
Maximum Wire Size mm²
0.6mm²
Maximum Wire Size AWG
20AWG
Contact Material
Phosphor Bronze
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Termination Type
Crimp
Maximum Operating Temperature
105°C
Length
18.03mm
Standards/Approvals
No
Detalji o proizvodu
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.


