TE Connectivity Z-PACK HM Series Straight Through Hole PCB Socket, 3-Contact, 2.54 mm Pitch Solder
Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityNumber of Contacts
3
Product Type
PCB Socket
Sub Type
Board-to-Board
Pitch
2.54mm
Current
1.15A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Through Hole
Orientation
Straight
Connector System
Board-to-Board
Voltage
250 V
Series
Z-PACK HM
Minimum Operating Temperature
-65°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
RoHS
Zemlja podrijetla
China
Detalji o proizvodu
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Informacije o stanju skladišta trenutno nisu dostupne.
€ 304,80
€ 5,08 komadno (u cijevi od 60) (bez PDV-a)
€ 381,00
€ 6,35 komadno (u cijevi od 60) (s PDV-om)
60
€ 304,80
€ 5,08 komadno (u cijevi od 60) (bez PDV-a)
€ 381,00
€ 6,35 komadno (u cijevi od 60) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
60
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityNumber of Contacts
3
Product Type
PCB Socket
Sub Type
Board-to-Board
Pitch
2.54mm
Current
1.15A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Through Hole
Orientation
Straight
Connector System
Board-to-Board
Voltage
250 V
Series
Z-PACK HM
Minimum Operating Temperature
-65°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
RoHS
Zemlja podrijetla
China
Detalji o proizvodu
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda