TE Connectivity Backplane Connector Through Hole, 4, 250V 10A
Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
Zemlja podrijetla
United States
Detalji o proizvodu
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
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Informacije o stanju skladišta trenutno nisu dostupne.
€ 12,25
€ 12,25 Each (Supplied in a Tube) (bez PDV-a)
€ 15,31
€ 15,31 Each (Supplied in a Tube) (s PDV-om)
Proizvodno pakiranje (cijev)
1
€ 12,25
€ 12,25 Each (Supplied in a Tube) (bez PDV-a)
€ 15,31
€ 15,31 Each (Supplied in a Tube) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
Proizvodno pakiranje (cijev)
1
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Tehnička dokumentacija
Tehnički podaci
Proizvođač
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
Zemlja podrijetla
United States
Detalji o proizvodu
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
- Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
- Pregledajte i doprinesite sadržaju internet stranice i foruma
- Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda