Tehnička dokumentacija
Tehnički podaci
Proizvođač
TokoInductance
12 nH
Maximum dc Current
180mA
Package/Case
0201 (0603M)
Length
0.6mm
Depth
0.3mm
Height
0.3mm
Dimensions
0.6 x 0.3 x 0.3mm
Tolerance
±5%
Maximum DC Resistance
700mΩ
Series
LLS0603-FH
Core Material
Ceramic
Maximum Self Resonant Frequency
2.5GHz
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Inductor Construction
Multilayer
Minimum Quality Factor
11
Zemlja podrijetla
China
Detalji o proizvodu
Toko 0201 LLS0603-FH Series Multilayer Ceramic Inductors
TOKO LLS0603-FH series multilayer chip inductors are highly reliable multilayer SMD inductors with a dual frequency standard per inductance value, plated terminals, integrated ceramic structure and tight physical tolerance dimensions. The LLS0603-FH series inductors are ideal for use in RF modules, embedded subassemblies or other applications where space is limited and printed stripline inductors are impractical.
Cijena na upit
komadno (u vrećici od 100) (bez PDV-a)
Standard
100
Cijena na upit
komadno (u vrećici od 100) (bez PDV-a)
Informacije o stanju skladišta trenutno nisu dostupne.
Standard
100
Informacije o stanju skladišta trenutno nisu dostupne.
Tehnička dokumentacija
Tehnički podaci
Proizvođač
TokoInductance
12 nH
Maximum dc Current
180mA
Package/Case
0201 (0603M)
Length
0.6mm
Depth
0.3mm
Height
0.3mm
Dimensions
0.6 x 0.3 x 0.3mm
Tolerance
±5%
Maximum DC Resistance
700mΩ
Series
LLS0603-FH
Core Material
Ceramic
Maximum Self Resonant Frequency
2.5GHz
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Inductor Construction
Multilayer
Minimum Quality Factor
11
Zemlja podrijetla
China
Detalji o proizvodu
Toko 0201 LLS0603-FH Series Multilayer Ceramic Inductors
TOKO LLS0603-FH series multilayer chip inductors are highly reliable multilayer SMD inductors with a dual frequency standard per inductance value, plated terminals, integrated ceramic structure and tight physical tolerance dimensions. The LLS0603-FH series inductors are ideal for use in RF modules, embedded subassemblies or other applications where space is limited and printed stripline inductors are impractical.


