Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
1.27 mm, 2.54 mm
End 1
14 Pin Female SOP
End 2
14 Pin Male DIP
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 50,70
€ 10,14 komadno (u pakiranju od 5) (bez PDV-a)
€ 63,38
€ 12,675 komadno (u pakiranju od 5) (s PDV-om)
5
€ 50,70
€ 10,14 komadno (u pakiranju od 5) (bez PDV-a)
€ 63,38
€ 12,675 komadno (u pakiranju od 5) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
5
Informacije o stanju skladišta trenutno nisu dostupne.
| količina | jedinična cijena | Po pakiranje | 
|---|---|---|
| 5 - 120 | € 10,14 | € 50,70 | 
| 125 - 370 | € 9,26 | € 46,30 | 
| 375 - 995 | € 8,58 | € 42,90 | 
| 1000 - 1995 | € 7,80 | € 39,00 | 
| 2000+ | € 7,53 | € 37,65 | 
Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
1.27 mm, 2.54 mm
End 1
14 Pin Female SOP
End 2
14 Pin Male DIP
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


