Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 72,15
€ 14,43 komadno (u pakiranju od 5) (bez PDV-a)
€ 90,19
€ 18,038 komadno (u pakiranju od 5) (s PDV-om)
5
€ 72,15
€ 14,43 komadno (u pakiranju od 5) (bez PDV-a)
€ 90,19
€ 18,038 komadno (u pakiranju od 5) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
5
Informacije o stanju skladišta trenutno nisu dostupne.
| količina | jedinična cijena | Po pakiranje |
|---|---|---|
| 5 - 120 | € 14,43 | € 72,15 |
| 125 - 370 | € 13,17 | € 65,85 |
| 375 - 995 | € 12,20 | € 61,00 |
| 1000 - 1995 | € 11,10 | € 55,50 |
| 2000+ | € 10,71 | € 53,55 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


