Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.5 mm, 2.54 mm
End 1
MSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
MSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 97,30
€ 19,46 komadno (u pakiranju od 5) (bez PDV-a)
€ 121,62
€ 24,325 komadno (u pakiranju od 5) (s PDV-om)
5
€ 97,30
€ 19,46 komadno (u pakiranju od 5) (bez PDV-a)
€ 121,62
€ 24,325 komadno (u pakiranju od 5) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
5
Informacije o stanju skladišta trenutno nisu dostupne.
| količina | jedinična cijena | Po pakiranje |
|---|---|---|
| 5 - 120 | € 19,46 | € 97,30 |
| 125 - 370 | € 17,77 | € 88,85 |
| 375 - 995 | € 16,45 | € 82,25 |
| 1000 - 1995 | € 14,98 | € 74,90 |
| 2000+ | € 14,45 | € 72,25 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.5 mm, 2.54 mm
End 1
MSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
MSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


