Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Informacije o stanju skladišta trenutno nisu dostupne.
Provjerite ponovno kasnije.
€ 16,75
komadno (u pakiranju od 5) (bez PDV-a)
€ 20,938
komadno (u pakiranju od 5) (s PDV-om)
5
€ 16,75
komadno (u pakiranju od 5) (bez PDV-a)
€ 20,938
komadno (u pakiranju od 5) (s PDV-om)
5
Kupujte na veliko
količina | jedinična cijena | Po pakiranje |
---|---|---|
5 - 120 | € 16,75 | € 83,75 |
125 - 370 | € 15,25 | € 76,25 |
375 - 995 | € 14,25 | € 71,25 |
1000 - 1995 | € 13,00 | € 65,00 |
2000+ | € 12,50 | € 62,50 |
Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.