Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.65 mm, 2.54 mm
End 1
QSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
QSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 56,65
€ 11,33 komadno (u pakiranju od 5) (bez PDV-a)
€ 70,81
€ 14,162 komadno (u pakiranju od 5) (s PDV-om)
5
€ 56,65
€ 11,33 komadno (u pakiranju od 5) (bez PDV-a)
€ 70,81
€ 14,162 komadno (u pakiranju od 5) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
5
Informacije o stanju skladišta trenutno nisu dostupne.
| količina | jedinična cijena | Po pakiranje | 
|---|---|---|
| 5 - 120 | € 11,33 | € 56,65 | 
| 125 - 370 | € 10,34 | € 51,70 | 
| 375 - 995 | € 9,58 | € 47,90 | 
| 1000 - 1995 | € 8,72 | € 43,60 | 
| 2000+ | € 8,41 | € 42,05 | 
Tehnička dokumentacija
Tehnički podaci
Proizvođač
WinslowPitch
0.65 mm, 2.54 mm
End 1
QSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
QSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


