331031271520, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 2.7mm x 1.5mm x 2mm

RS kataloški broj:: 773-4230robna marka: Wurth ElektronikProizvođački broj:: 331031271520
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Tehnička dokumentacija

Tehnički podaci

Proizvođač

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

2mm

Length

2.7mm

Width_SC_PC

1.5mm

Detalji o proizvodu

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

€ 5,50

€ 1,10 komadno (u vrećici od 5) (bez PDV-a)

€ 6,88

€ 1,375 komadno (u vrećici od 5) (s PDV-om)

331031271520, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 2.7mm x 1.5mm x 2mm

5

Dostupno u više komada 5
5€ 5,50
10€ 11,00
15€ 16,50
20€ 22,00
25€ 26,75
30€ 32,10
35€ 37,45
40€ 42,80
45€ 48,15
50€ 51,50
55€ 56,65
60€ 61,80
65€ 66,95
70€ 72,10
75€ 77,25

€ 5,50

€ 1,10 komadno (u vrećici od 5) (bez PDV-a)

€ 6,88

€ 1,375 komadno (u vrećici od 5) (s PDV-om)

331031271520, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 2.7mm x 1.5mm x 2mm

Informacije o stanju skladišta trenutno nisu dostupne.

5

Dostupno u više komada 5
5€ 5,50
10€ 11,00
15€ 16,50
20€ 22,00
25€ 26,75
30€ 32,10
35€ 37,45
40€ 42,80
45€ 48,15
50€ 51,50
55€ 56,65
60€ 61,80
65€ 66,95
70€ 72,10
75€ 77,25

Informacije o stanju skladišta trenutno nisu dostupne.

količinajedinična cijenaPo vrećica
5 - 20€ 1,10€ 5,50
25 - 45€ 1,07€ 5,35
50 - 95€ 1,03€ 5,15
100 - 245€ 1,02€ 5,10
250+€ 0,95€ 4,75

Tehnička dokumentacija

Tehnički podaci

Proizvođač

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

2mm

Length

2.7mm

Width_SC_PC

1.5mm

Detalji o proizvodu

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.