331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm

RS kataloški broj:: 773-4277robna marka: Wurth ElektronikProizvođački broj:: 331171302030
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Tehnička dokumentacija

Tehnički podaci

Proizvođač

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

3mm

Length

3.15mm

Width_SC_PC

2mm

Detalji o proizvodu

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Informacije o stanju skladišta trenutno nisu dostupne.

Provjerite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

€ 1,44

komadno (u vrećici od 5) (bez PDV-a)

€ 1,80

komadno (u vrećici od 5) (s PDV-om)

331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm

5

Dostupno u više komada 5
5€ 7,20
10€ 14,40
15€ 21,60
20€ 28,80
25€ 35,00
30€ 42,00
35€ 49,00
40€ 56,00
45€ 63,00
50€ 67,00
55€ 73,70
60€ 80,40
65€ 87,10
70€ 93,80
75€ 100,50

€ 1,44

komadno (u vrećici od 5) (bez PDV-a)

€ 1,80

komadno (u vrećici od 5) (s PDV-om)

331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm
Informacije o stanju skladišta trenutno nisu dostupne.

5

Dostupno u više komada 5
5€ 7,20
10€ 14,40
15€ 21,60
20€ 28,80
25€ 35,00
30€ 42,00
35€ 49,00
40€ 56,00
45€ 63,00
50€ 67,00
55€ 73,70
60€ 80,40
65€ 87,10
70€ 93,80
75€ 100,50

Kupujte na veliko

količinajedinična cijenaPo vrećica
5 - 20€ 1,44€ 7,20
25 - 45€ 1,40€ 7,00
50 - 95€ 1,34€ 6,70
100 - 245€ 1,33€ 6,65
250+€ 1,24€ 6,20

Tehnička dokumentacija

Tehnički podaci

Proizvođač

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

3mm

Length

3.15mm

Width_SC_PC

2mm

Detalji o proizvodu

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.