331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm

RS kataloški broj:: 773-4277robna marka: Wurth ElektronikProizvođački broj:: 331171302030
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Tehnička dokumentacija

Tehnički podaci

Proizvođač

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

3mm

Length

3.15mm

Width_SC_PC

2mm

Detalji o proizvodu

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

€ 7,00

€ 1,40 komadno (u vrećici od 5) (bez PDV-a)

€ 8,75

€ 1,75 komadno (u vrećici od 5) (s PDV-om)

331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm

5

Dostupno u više komada 5
5€ 7,00
10€ 14,00
15€ 21,00
20€ 28,00
25€ 34,00
30€ 40,80
35€ 47,60
40€ 54,40
45€ 61,20
50€ 65,50
55€ 72,05
60€ 78,60
65€ 85,15
70€ 91,70
75€ 98,25

€ 7,00

€ 1,40 komadno (u vrećici od 5) (bez PDV-a)

€ 8,75

€ 1,75 komadno (u vrećici od 5) (s PDV-om)

331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm

Informacije o stanju skladišta trenutno nisu dostupne.

5

Dostupno u više komada 5
5€ 7,00
10€ 14,00
15€ 21,00
20€ 28,00
25€ 34,00
30€ 40,80
35€ 47,60
40€ 54,40
45€ 61,20
50€ 65,50
55€ 72,05
60€ 78,60
65€ 85,15
70€ 91,70
75€ 98,25

Informacije o stanju skladišta trenutno nisu dostupne.

količinajedinična cijenaPo
5 - 20€ 1,40€ 7,00
25 - 45€ 1,36€ 6,80
50 - 95€ 1,31€ 6,55
100 - 245€ 1,30€ 6,50
250+€ 1,21€ 6,05

Tehnička dokumentacija

Tehnički podaci

Proizvođač

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

3mm

Length

3.15mm

Width_SC_PC

2mm

Detalji o proizvodu

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.