Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 8 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

RS kataloški broj:: 670-0406brend: MolexProizvođački broj:: 43045-0801
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Tehnička dokumentacija

Tehnički podaci

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

8

Number Of Rows

2

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Gold

Contact Material

Brass

Current Rating

5.0A

Series Number

43045

Voltage Rating

250.0 V

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Molex Micro-Fit 3.0 Series

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Informacije o stanju skladišta trenutno nisu dostupne.

Proverite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

RSD 613,984

komadno (u pakovanju od 5) (bez PDV-a)

RSD 736,781

komadno (u pakovanju od 5) (s PDV-om)

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 8 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Odaberite vrstu pakovanja

RSD 613,984

komadno (u pakovanju od 5) (bez PDV-a)

RSD 736,781

komadno (u pakovanju od 5) (s PDV-om)

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 8 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Informacije o stanju skladišta trenutno nisu dostupne.
Odaberite vrstu pakovanja

Kupujte na veliko

količinaJedinična cenaPo pakovanje
5 - 95RSD 613,984RSD 3.070
100 - 370RSD 502,944RSD 2.515
375 - 1495RSD 457,222RSD 2.286
1500 - 2995RSD 391,905RSD 1.960
3000+RSD 378,841RSD 1.894

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više

Tehnička dokumentacija

Tehnički podaci

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

8

Number Of Rows

2

Body Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Gold

Contact Material

Brass

Current Rating

5.0A

Series Number

43045

Voltage Rating

250.0 V

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Molex Micro-Fit 3.0 Series

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više