TE Connectivity Vibration Sensor, 0°C → +70°C
Tehnička dokumentacija
Tehnički podaci
Brand
TE ConnectivityLength
41mm
Width
16mm
Depth
0.04mm
Minimum Operating Temperature
0°C
Maximum Operating Temperature
+70°C
Dimensions
41 (mm) x 16 (mm) x 40 (μm)
Zemlja podrijetla
China
Detalji o proizvodu
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.
RSD 181.452
RSD 1.814,519 komad (u kutiji od 100) (bez PDV-a)
RSD 217.742
RSD 2.177,423 komad (u kutiji od 100) (s PDV-om)
100
RSD 181.452
RSD 1.814,519 komad (u kutiji od 100) (bez PDV-a)
RSD 217.742
RSD 2.177,423 komad (u kutiji od 100) (s PDV-om)
100
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Tehnička dokumentacija
Tehnički podaci
Brand
TE ConnectivityLength
41mm
Width
16mm
Depth
0.04mm
Minimum Operating Temperature
0°C
Maximum Operating Temperature
+70°C
Dimensions
41 (mm) x 16 (mm) x 40 (μm)
Zemlja podrijetla
China
Detalji o proizvodu
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.