Tehnička dokumentacija
Tehnički podaci
Brand
TE ConnectivityLength
41mm
Width
16mm
Depth
0.04mm
Minimum Operating Temperature
0°C
Maximum Operating Temperature
+70°C
Dimensions
41 (mm) x 16 (mm) x 40 (μm)
Detalji o proizvodu
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivitys MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.
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RSD 2.907
komad (isporučivo u kutiji) (bez PDV-a)
RSD 3.488
komad (isporučivo u kutiji) (s PDV-om)
1
RSD 2.907
komad (isporučivo u kutiji) (bez PDV-a)
RSD 3.488
komad (isporučivo u kutiji) (s PDV-om)
1
Kupujte na veliko
količina | Jedinična cena |
---|---|
1 - 9 | RSD 2.907 |
10 - 24 | RSD 2.057 |
25 - 49 | RSD 1.992 |
50+ | RSD 1.894 |
Tehnička dokumentacija
Tehnički podaci
Brand
TE ConnectivityLength
41mm
Width
16mm
Depth
0.04mm
Minimum Operating Temperature
0°C
Maximum Operating Temperature
+70°C
Dimensions
41 (mm) x 16 (mm) x 40 (μm)
Detalji o proizvodu
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivitys MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.